Losses Calculation of IGBT Module and Heat Dissipation System Design of Inverters 变频器中的IGBT模块损耗计算及散热系统设计
While the benefits of overheating are specific to the module, the cost-heat buildup-is cumulative to the rack that the module resides in, which has a fixed heat dissipation rate. 过热的副作用具体到模块(装备),热量的消耗、产生和堆积在机架的内部有一个固定的散热率。
Through shearing test of high damping rubber, the paper analyzes the influence of shearing shape, shearing strain range and inspiriting frequence on the characteristic parameters ( dynamic shear elastic module, dissipation engineering module, wasted gene). 通过高阻尼橡胶剪切试验,分析了高阻尼橡胶剪切面形状、剪应变幅值、激励频率和试件高度对特征参数(动态剪切弹性模量、耗能模量、损耗因子)的影响。
In 3D-MCM ( multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved. 在3D-MCM(多芯片组件)封装设计中,大功率和高热流密度导致系统的散热成为关键技术之一。
Other two optimizations to reduce the memory unit were also adopted in the key module design to limit the power dissipation. 同时,采用其他两种减少存储空间的优化设计方案和流水线策略,进一步减少了SOVA子译码器的功耗。
1.3 μ m Optical Transmitter Module with Low Power Dissipation 1.3μm低功耗光发射模块
SMU module adopts the clock-gating method was applied to the survivor path storage block, reduce the survivor path storage memory power dissipation effectively. 在幸存路径管理模块采用门控时钟的方法,有效地降低了对幸存路径存储部分的功耗。
Dynamic frequency reconfiguration technology, which allows the clock speed of circuit module to be dynamically changed by software, supports some advantages, such as minimizing power draw and heat dissipation, extending module life, and so on. 时钟频率动态重置技术,是指通过软件动态地改变电路模块的工作时钟频率,以达到降低功耗、减少散热,延长电路模块使用寿命等作用。
The experimental result states that each circuit module of the converter works properly. Besides, it have good heat dissipation, less radioactivity and strong anti-interference ability. 实验表明,本变换器中的各电路模块运行正常,散热效果好,电磁辐射小,抗干扰能力强。
In general, this type of ADC, as an important mixed-signal module, is embedded in the SOC of the application systems. So this type of ADC needs to be compatible with digital CMOS process and low supply voltage, and lower dissipation. 通常这类模数转换器作为重要的数模混合信号模块嵌入在整个应用系统的SOC上,需要能兼容数字工艺和数字系统的低电源电压,并且追求低功耗。